The global electronics industry is undergoing a complex transformation driven by AI, IoT, and increasing product customization. One of the consequences is an exponential rise in Bill of Materials (BOM) complexity. This thesis analyzes how Siemens addresses these challenges through the Digital Thread concept and the Digital Thread backbone that integrates design, manufacturing, and management. The focus is on the Opcenter Execution Electronics solution, which shows the functionalities that optimize PCB production. The core of the dissertation features an original application demo, developed to simulate the entire manufacturing process and validate the software's effectiveness in reducing manual errors and enhancing industrial KPIs.