The evolution of electronic packaging has progressed through distinct technological phases, each addressing the increasing demands for miniaturization and performance. Starting from traditional printed circuit board (PCB) technology, to multi-chip-modules (MCM) to more modern technologies such as system-on-a-chip (SoC), System in a package (SiP) and Heterogenous Integration (HI) however what has not changed is the need to create stable connections between devices and substrates and the different die attach processes are what enables these advanced packaging approaches. The selection of appropriate die attach materials and methods directly impacts device performance, reliability, and manufacturability of an entire system or device. Therefore for consumer applications the die attach is essential for everything ranging from smartphones, smart-appliances, wearables to Internet of Things (IoT) sensors where thermal mangment and miniaturization are critical.