The level of components integration in ICs is no longer able to follow Moore's law. The transistors’ dimension cannot be further reduced due to technological and physical limitations and the 2D architectures are unable to guarantee the required levels of integration. This is a huge obstacle for the silicon industry in which the demand for more and more powerful and performing components has increased exponentially in the last decade, and this trend does not seem to want to change. To solve this issue, new integration strategies have been developed. The 3D IC provides an elegant solution where the construction of the circuit develops on several vertical tiers.