The increasing development of electronic devices, including portable electronic devices as laptop, tablet and smartphones, has led to enhance processors performance thus capable of delivering higher powers in even narrow and restricted spaces. The direct consequence concerns hot-spot formation, threatening to deteriorate processor reliability and lifespan. The miniaturization of such electronic devices gives rise to effective cooling and heat spreading system capable of dissipating heat fluxes progressively higher. For this purpose, vapor chambers display an efficacious solution as heat spreader. Similarly to heat pipes, vapor chambers are passive thermal devices that uses phase change process to minimize thermal conductivity, achieving excellent results when compared with traditional cooling system.