The increasing integration of power electronics in aerospace and defence applications presents significant challenges in terms of thermal management, due to the high power densities and stringent reliability requirements. The rise in power densities and the use of compact, high-performance components necessitate cooling systems that can effectively dissipate generated heat while ensuring reliability, a lightweight design, and compliance with the strict dimensional and operational constraints typical of these applications. This thesis presents a comparative analysis and a preliminary feasibility study of two advanced cooling technologies aimed at optimizing the thermal performance of power electronics modules. The work is structured in two main phases.