The present work is dedicated to the study of warpage that takes place on direct bonded copper (DBC) substrates. The ultimate goal of the work at hand is to establish a universal standard for identifying and predicting warpage behavior in DBC substrates. To achieve this, the study aims to conduct simulations in parallel with experimental measurements on real-time and applicable components. The study's methodology is divided into three main stages: post-production, post-reflow, and post-operation of the DBC substrates. Within each stage, corresponding simulations have been performed in COMSOL Multiphysics in parallel with the experimental measurements, which were undertaken using the KLA Tencor P-17 Profiler.