In a world where energy is ever more important studies have been focusing on renewable technology for energy generation, many of which have encountered roadblocks that prevented their widespread adoption. Thus, it is of great interest to look to new technologies whose potential is still relatively untapped, such as ThermoElectric Generation (TEG) devices, able to generate energy by using the Seebeck effect. The basic configuration includes semiconductor chips bonded to an electrode through solder (such as AgSn solder). But due to an exceedingly low melting point, the operational temperature range is not wide enough so in this work a Ag/Epoxy based paste will be evaluated as a substitute.