polito.it
Politecnico di Torino (logo)
Webthesis
Libraries

Realization of a flip chip bonding technique for the assembly of sub-mm neural electrodes

Gabriele Lodi

Realization of a flip chip bonding technique for the assembly of sub-mm neural electrodes.

Rel. Danilo Demarchi. Politecnico di Torino, Corso di laurea magistrale in Ingegneria Elettronica (Electronic Engineering), 2018

[img]
Preview
 PDF (Tesi_di_laurea) - Tesi
Licenza: Creative Commons Attribution Non-commercial No Derivatives.
Download (41MB) | Preview
Abstract:

Elettrodi neurali ad ultrasuoni per il brain-machine interface (neural dust).
Relators: Danilo Demarchi
Academic year: 2017/18
Publication type: Electronic
Number of Pages: 127
Subjects:
Corso di laurea: Corso di laurea magistrale in Ingegneria Elettronica (Electronic Engineering)
Classe di laurea: New organization > Master science > LM-29 - ELECTRONIC ENGINEERING
Ente in cotutela: University of California, Berkeley - EECS (STATI UNITI D'AMERICA)
Aziende collaboratrici: UNSPECIFIED
URI: http://webthesis.biblio.polito.it/id/eprint/7608
Modify record (reserved for operators) Modify record (reserved for operators)