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Realization of a flip chip bonding technique for the assembly of sub-mm neural electrodes

Lodi, Gabriele

Realization of a flip chip bonding technique for the assembly of sub-mm neural electrodes.

Rel. Danilo Demarchi. Politecnico di Torino, Corso di laurea magistrale in Ingegneria Elettronica (Electronic Engineering), 2018

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Abstract:

Elettrodi neurali ad ultrasuoni per il brain-machine interface (neural dust).

Relators: Danilo Demarchi
Academic year: 2017/18
Publication type: Electronic
Number of Pages: 127
Subjects:
Corso di laurea: Corso di laurea magistrale in Ingegneria Elettronica (Electronic Engineering)
Classe di laurea: New organization > Master science > LM-29 - ELECTRONIC ENGINEERING
Ente in cotutela: University of California, Berkeley - EECS (STATI UNITI D'AMERICA)
Aziende collaboratrici: UNSPECIFIED
URI: http://webthesis.biblio.polito.it/id/eprint/7608
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