In the last years, Reconfigurable Systems-on-Chip and SRAM-based Field Programmable Gate Arrays have been widely adopted for mission-critical tasks in aerospace, avionics and automotive, mainly thanks to their flexibility and low costs. Although, one of their main drawbacks is the high susceptibility to radiations-charged particles, both in space and at sea level. Among the several mitigation techniques, Isolation Design Flow obtains promising results in terms of reliability improvement and required time to implement it by acting only at the floorplanning phase. However, when considering numerous blocks and complex systems, implementation of state-of-the-art Isolation Design Flow can lead to a difficult (or even impossible) placement stage.