Automatic Test Equipment structure mass reduction by means of topology optimization process

Nowadays, electronics surrounds every aspect of our life and almost every device has got an electronic board installed. From vehicles to smartphones, from tablets to the most complex aerospace, medical and military devices, this is a world guided by the continuous discovery of new technologies, which implies a continuous evolution of the systems utilized for the automatic testing of semiconductors, MEMS and electronic boards. In engineering practice is often highlighted the need to decrease the mass of a structure, preserving an adequate stiffness and resistance. One of the simplest and traditional solutions would be the choice of a different material, lighter, and at the same time, with higher mechanical properties with respect to the one previously used. However, this solution is often related to an increase in the cost of the material, which make this option not always viable. The question now would be: is there another way to reduce the mass of a structure while maintaining the mechanical characteristic of the structure, in terms of strength and stiffness? The answer can be found in what is called optimization processes. The term “optimization” is related to the process of making something as good or effective as possible [1]. Optimization processes take place by trying to minimize or maximize certain quantities without violating any of the constraints set by the problem itself. In the past, these were trial and error processes, but nowadays, thanks to the development of computational tools based on the optimization theory, it is possible to reach such goal in a more automatic way, achieving also high costs saving in the designing process avoiding the production of several prototypes. The aim of this thesis is the study of the mass reduction of the structure, by means of topology optimization processes, of some automated test equipment (ATE) for assembled electronic boards (PCBAs) and modules, designed and manufactured by SPEA, one of the global leaders in this high-tech field. Starting from the original model and knowing its mechanical characteristics it was possible to find some parameters to set as benchmarks in order to be able to compare the results obtained by means of the topology optimization process. The results of such a process, which can be subdivided into five main stages, were then analyzed and a final manufacturable solution, capable to meet the request of being lighter but at the same time comparable in terms of displacement was presented.