In this research, the effect of electromagnetic-sensitive additives on the reversibility performance of Hot-Melt Adhesives (HMA), is studied. Test Single Lap Joints (SLJ) were made of Acrylonitrile Butadiene Styrene (ABS) adherends that were bonded using the modified thermoplastic HMA. The heat produced by the interactions of a high-frequency electromagnetic field with the particles is used to bond the test joints. Particles of 2 sizes were added to the adhesive in 6 increasing weight percentages, up to 70 %. Variables such as process time, adhesive thickness and surface preparation were kept constant for all the specimens. Tensile-shear tests at 2 different temperatures, before and after environmental exposure, and debonding tests were performed.