The development of thermally conductive polymeric materials has attracted increasing interest due to the growing demand for lightweight and additively manufacturable components capable of efficient heat dissipation. In particular, enhancing the thermal conductivity of photopolymerizable resins represents a key challenge for expanding their application in functional 3D printed parts, such as rapid tooling and thermally managed components. This work focuses on the development of a hybrid photocurable resin system designed for Digital Light Processing (DLP) additive manufacturing. The formulation is primarily based on an acrylate matrix combined with 20 wt% of an epoxy component in order to increase the overall mechanical performance through a dual-curing strategy.