Life Cycle Assessment Of Electronic Devices

This work resolves to assess the state-of-the-art techniques for conducting Life Cycle Assessment (LCA) and to establish a foundation for environmentally conscious integrated circuit (IC) design by determining the determinants affecting equivalent CO2 emissions during the production and utilisation of chips. Life Cycle Assessment (LCA) and green electronic design presents a development strategy in the manufacturing of sustainable electronics. As resources get depleted, pollutants continue to be discharged, energy usage increases and global warming becomes a major menace, and LCA gives a methodical structure to study total environmental implications within the life cycle of the product from its extraction to end-of-life management. This thesis provides a comprehensive review of Lifecycle Assessment (LCA) of electronic devices to assess their environmental consequences and pinpoint potential for sustainable enhancement. The research complies with ISO 14040 and ISO 14044 standards, highlighting the essential stages of Life Cycle Assessment. It commences with a comprehensive examination of the historical development of LCA, its techniques, and its significance within the electronics industry. A comprehensive literature study identifies the key problems in implementing Life Cycle Assessment (LCA) for electronics, such as intricate product compositions, restricted data accessibility, and the energy-demanding processes involved in semiconductor manufacturing. The study emphasises low-power design strategies as a primary tool for mitigating environmental effect. Both static and dynamic power reduction techniques are analysed, along with cross-layer optimisation strategies and the associated trade-offs in power management. Additionally, the thesis presents the Design for 3R (Reduce, Repair, Refurbish) paradigm and examines eco-design practices. To enhance the environmental performance of device fabrication, this work also explores the substitution of conventional dielectric materials (e.g., SiO₂) with low-temperature, high-κ alternatives such as Ta₂O₅. The chapter on data interpretation and analysis examines power dissipation and corresponding CO2 emissions across several CMOS technology nodes, incorporating region specific emission variables to evaluate operational and manufacturing effects. The findings indicate that technological scaling improves device efficiency but increases leakage currents and energy consumption in advanced nodes. Thus, power-conscious design and sustainable manufacturing are essential. This study promotes green electronics by supporting a lifecycle-oriented approach to sustainable design and policy by supporting a lifecycle-oriented approach to sustainable design and policy. This work poses the foundation for future environmental-aware development of ICs, by following proper design and fabrication strategies that match the environmental impact goals of the addressed application. Future research should integrate AI into Life Cycle Sustainability Assessment (LCSA), expand to social and economic dimensions, develop design-integrated tools, focus on green material substitution, policy-driven applications, and translate complex LCA results into consumer-friendly environmental metrics.