The evolution of power electronics world brings a continuous miniaturization of components with an increase in power density. Due to this, thermal management is becoming a critical limit for devices performance and reliability. Traditional cooling technologies go through limitations in efficiency, size, and adaptability, so exploring novel cooling mechanisms is becoming essential to address the increasing heat dissipation challenges in power electronics. Despite few advancements in conventional and even some emerging applications, the full potential of the pyroelectric effect, a thermally induced polarization phenomenon, for active cooling applications remains largely unexplored. Currently, no known system exploits this effect for convective cooling without the presence of any external electric sources or mechanical parts.