Driven by the increasing demand for smaller, lighter and more efficient devices, the electronic evolution is moving towards new approaches that enable the achievement of this goal. The solution is to increase the integration level of electronic components. Two of these levels are the integration in package (System-in-Package, SiP) and the integration in board (Printed Circuit Board, PCB). The former provides a method to integrate multiple bare die devices or passive components within the same package, while the latter enables the integration into a board in which packaged devices, including SiPs, are interconnected through conductive traces. The use of SiP and PCB with reduced dimensions allows to move towards miniaturized applications employed in various fields, including smartphones, automotive applications, aerospace, medical systems, and wearable devices.