SEM analysis of intramark variations in alignment targets

In this project, the main aim is to understand better how the details of alignment targets influence the wafer alignment performance. Generally speaking, this project involves knowledge of the wafer processing, the response by optical metrology tools to it and the underlying physics. Practically speaking, the student will get familiar with a state-of-the-art optical metrology tool in a research lab of ASML and perform measurements on it. Major part of the project will focus on analyzing (using MATLAB) and understanding the obtained data, which will also require to refine and improve existing algorithms to get meaningful results. The work will be done in a small research team setting and give an insight into research in the semiconductor industry.