This thesis is the result of my six months internship at FCA Mirafiori Die Shop. The objective of my internship is to study current die engineering and manufacturing workflow and weak point elimination activities. At the beginning of my internship, I attended a training period regarding all activities in stamping technology department, die engineering department and die manufacturing department, in order to understand the internal die development process, including die feasibility, die process, die design, die simulation, milling path design, machining, assembly, benchwork, try-out and quality control. Moreover, some basic knowledge of project management and validation method have been acquired. After this period, I started to follow weak point elimination activities.