Hot Lithography of High-Performance Polymers

This thesis investigates the thermal and mechanical behavior of interpenetrating polymer network (IPN) resins developed for hot lithography, a breakthrough technology in additive manufacturing and vat photopolymerization over the past decade. Methacrylate resins are extensively utilized in 3D printing technologies due to their high reactivity and excellent printability. However, their inherent brittleness limits their mechanical performance. In contrast, epoxy resins exhibit strength, durability, and load-bearing capacity. The formation of interpenetrating polymer networks (IPNs) by combining methacrylate and epoxy systems represents a synergistic strategy that integrates the advantageous properties of both materials, thereby enhancing the overall performance of the resulting polymer network. In this study, the mechanical properties of the IPN resins are evaluated through tensile, impact, and creep tests. The curing process is validated using differential scanning calorimetry (DSC) and Fourier-transform infrared spectroscopy (FTIR). Additional characterization includes rheological analysis, dynamic mechanical thermal analysis (DMTA) and imaging of samples using scanning electron microscopy (SEM). The results demonstrate that IPN structures can be created by UV-curing through 3D printing and they can be thermally treated to unlock the potential of their mechanical properties. The obtained formulations are suitable for hot lithography.