Development of a Simplified Mathematical Model for FBG Sensor Bonding: Combining Mechanical Deformation and Thermal Expansion Effects
Alfredo Esposito
Development of a Simplified Mathematical Model for FBG Sensor Bonding: Combining Mechanical Deformation and Thermal Expansion Effects.
Rel. Matteo Davide Lorenzo Dalla Vedova, Paolo Maggiore, Marco Gherlone, Alessandro Aimasso, Matteo Bertone. Politecnico di Torino, Corso di laurea magistrale in Ingegneria Aerospaziale, 2024
