In recent years, photopolymerization process has gained more and more importance according to its economical and ecological value. A wide range of application are based on photopolymers such as adhesives, coatings, inks and microelectronics covering a huge number of fields such as biomedical and industrial sectors. The main drawback related to UV-curing processes is the inability to reach deep layers and creating three-dimensional thick crosslinked structure principally due to the light absorption phenomena. RICFP process is defined as the combination of a photo-induced surface curing of the formulation and the subsequent thermal-activated reaction front which will lead to the polymerization of thick parts in a short time.