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Thesis by Virgilio, Eugenia

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Thesis

Eugenia Virgilio. Analisi del processo di incapsulamento di un chip elettronico mediante l’utilizzo del software Moldex3D = Analysis of the encapsulation process of an electronic chip using Moldex3D. Rel. Alberto Frache, Rossella Arrigo, Marco Rovitto. Politecnico di Torino, Corso di laurea magistrale in Ingegneria Dei Materiali, 2021

This list was generated on Fri May 17 04:35:16 2024 CEST.

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