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Thesis by Lodi, Gabriele

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Thesis

Gabriele Lodi. Realization of a flip chip bonding technique for the assembly of sub-mm neural electrodes. Rel. Danilo Demarchi. Politecnico di Torino, Corso di laurea magistrale in Ingegneria Elettronica (Electronic Engineering), 2018

This list was generated on Sat May 18 12:54:48 2024 CEST.

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